Solid-State Reactions between Cu(Ni) Alloys and Sn |
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Authors: | Vesa Vuorinen Tomi Laurila Toni Mattila Erkki Heikinheimo Jorma K Kivilahti |
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Institution: | (1) Laboratory of Electronics Production Technology, Helsinki University of Technology, P.O. Box 3000, Espoo, 02015 HUT, Finland;(2) Laboratory of Metallurgy, Helsinki University of Technology, P.O. Box 3000, Espoo, 02015 HUT, Finland |
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Abstract: | Solid-state interfacial reactions between Sn and Cu(Ni) alloys have been investigated at the temperature of 125°C. The following
results were obtained. Firstly, the addition of 0.1 at.% Ni to Cu decreased the total thickness of the intermetallic compound
(IMC) layer to about half of that observed in the␣binary Cu/Sn diffusion couple; the Ni addition decreased especially the
thickness of Cu3Sn. Secondly, the addition of 1 to 2.5 at.% Ni to Cu further decreased the thickness of Cu3Sn, increased that of Cu6Sn5 (compared to that in the binary Cu/Sn couple) and produced significant amount of voids at the Cu/Cu3Sn interface. Thirdly, the addition of 5 at.% Ni to Cu increased the total thickness of the IMC layer to about two times that
observed in the binary Cu/Sn diffusion couple and made the Cu3Sn disappear. Fourthly, in contrast to the previous case, the addition of 10 at.% Ni to Cu decreased the total IMC (Cu6Sn5) thickness again close to that of the Cu/Sn couple. With this Ni content no voids were detected. The results are rationalized
with the help of␣the thermodynamics of the Sn-Cu-Ni system as well as with kinetic considerations. |
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Keywords: | Intermetallic reactions Sn-Cu-Ni system Kirkendall voids thermodynamics kinetics |
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