Bis- or tetra-maleimides of substituted s-triazines chain-extended by imide,amide, and urea groups for fire- and heat-resistant applications

Novel phosphorylated bismaleimides and nonphosphorylated tetramaleimides containing substituted s-triazine rings (chain-extended by imide, amide, or urea groups) were prepared and polymerized. These polymer precursors were prepared by reacting 2,4-bis(4-aminophenoxy)-6-diethoxyphosphinyl-s-triazine or 2,4,6-tris(4-aminophenoxy)-s-triazine with maleic anhydride in combination with a bridging agent such as pyromellitic or benzophenone tetracarboxylic dianhydride, terephthaloyl chloride, and tolylene diisocyanate. The structure of polymer precursors was confirmed by infrared (IR) and proton nuclear magnetic resonance (¹H-NMR) spectroscopy and their curing behavior was investigated by differential thermal analysis (DTA). The phosphorylated bismaleimides were thermally polymerized at a lower temperature than did the corresponding nonphosphorylated tetramaleimides. Dynamic thermogravimetric analysis (TGA) showed that the nonphosphorylated and phosphorylated cured resins were stable up to 320–370 and 312–327°C, respectively, in nitrogen or air atmosphere. In addition, the latter afforded a relatively higher char yield. The relative thermal and thermooxidative stability of polymers with regard to the chemical structure of the bridging group was of the order imide > amide > urea. Upon isothermal aging the phosphorylated polymers exhibited a lower weight loss than did the corresponding nonphosphorylated polymers.