| 基于可靠性软件工具包RELEX7.6的电子产品设计过程优化 |
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| 引用本文： | 关义春.基于可靠性软件工具包RELEX7.6的电子产品设计过程优化[J].电子质量,2004(3):J014-J017,J030. |
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| 作者姓名： | 关义春 |
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| 作者单位： | 深圳市亿腾科技有限公司,咨询培训部,深圳,福田,518048 |
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| 摘 要： | 大型工具软件的引入,往往产生设计过程的调整;大型工具软件不仅是一种工具,同时在方法论上也有很成体系的一套做法.引入大型工程工具后,如不对原有过程进行调整,则很难充分发挥工具软件的作用.本文针对著名的可靠性软件工具包RELEX7.6引入后,如何相应进行电子产品开发流程的优化进行了的分析.结论指出结合RELEX7.6等软件进行流程优化,可使电子产品设计质量与成本有很大的提高.
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| 关 键 词： | 设计质量 可靠性 工具包 流程优化 |
Optimization of Electron Products Design Process Based on Reliability Software Tool Pack RELEX7.6 |
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| Guan Yicun Ph. D Shenzhen Yiteng Tech. Co. Ltd,Futian Shenzhen.Optimization of Electron Products Design Process Based on Reliability Software Tool Pack RELEX7.6[J].Electronics Quality,2004(3):J014-J017,J030. |
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| Authors: | Guan Yicun Ph D Shenzhen Yiteng Tech Co Ltd Futian Shenzhen |
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| Institution: | Guan Yicun Ph. D Shenzhen Yiteng Tech. Co. Ltd,Futian Shenzhen 518048 |
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| Abstract: | Based on CAD/CAE software,such as Reliability Tool Package-Relex 7.6, the design process of the Electronic Products can be improved. Without improvement of the design process after introduction of RELEX 7.6 , the power of the software can not bring into play very well. A design process improving method with Relex7.6 is given here, which shows the advantage with the software. |
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| Keywords: | Design Quality Reliability Tool Package Design Process Improvement |
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