聚乙烯/聚并苯复合材料室温电阻率变化规律研究

以新型导电材料聚并苯替代碳黑作为导电填料制备聚乙烯/聚并苯复合物.确定了复合物渗流转变区,并解释渗流转变现象的产生机理.从聚并苯含量和热处理过程,对聚乙烯/聚并苯复合物室温电阻率变化规律进行讨论.结果表明,聚并苯质量分数在20%～40%之间是聚乙烯/聚并苯复合物渗流转变区;热处理有利于聚乙烯晶区完善排列,也有利于导电链形成;以聚并苯作为导电填料所制备的复合物具有较高的PTC强度;辐射交联可以提高聚乙烯/聚并苯复合物PTC强度,抑制NTC效应.

Studies on Principle of Room Temperature Resistivity of Polyethylene/Polyacenic Semiconductor Composites

A novel conductive material——polyacenic semiconductor (PAS) was used as filler instead of carbon black (CB) to prepare polyethylene (PE)/PAS composites. The percolation threshold of PE/PAS composites was confirmed and the mechanism resulting in the phenomenon of percolation threshold was investigated. The room temperature resistivity of the conductive composites was studied from the content of PAS and heat-treatment method. The experimental results showed that the composites were in their percolation threshold,when the mass fraction of PAS was between 20% and 40%,heat-treatment method could make the crystal of PE and conductive chain complete;PE/PAS composites had a high PTC effect;radiation crosslinking could increase PTC effect and decrease NTC effect of composites.