| AlN陶瓷与可伐合金的活性封接 |
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| 引用本文： | 张玲艳,秦明礼,曲选辉,陆艳杰,张小勇.AlN陶瓷与可伐合金的活性封接[J].真空电子技术,2009(4):4-7. |
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| 作者姓名： | 张玲艳 秦明礼 曲选辉 陆艳杰 张小勇 |
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| 作者单位： | 1. 北京科技大学粉末冶金研究所,北京,100083
2. 北京有色金属研究院,北京,100088 |
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| 摘 要： | 采用Ag-Ti3活性焊料在真空条件下对AIN陶瓷与可伐合金进行了活性封接。采用SEMEDX，XRD，EBSD方法分析了焊接层的显微组织结构和相组成。测定了焊接力学性能，并对断裂表面进行了组织结构和相分析。在1240K真空条件下焊接性能良好，抗弯强度στ=205．89MPa，剪切强度στ=176．10MPa。
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| 关 键 词： | Ti-Ag活性焊料 活性封接 显微结构 封接强度 |
Active Brazing of AlN Ceramic with Kovar Alloy |
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| ZHANG Ling-yan,QIN Ming-li,QU Xuan-hui,LU Yan-jie,ZHANG Xiao-yong.Active Brazing of AlN Ceramic with Kovar Alloy[J].Vacuum Electronics,2009(4):4-7. |
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| Authors: | ZHANG Ling-yan QIN Ming-li QU Xuan-hui LU Yan-jie ZHANG Xiao-yong |
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| Institution: | ZHANG Ling-yan, QIN Ming-li, QU Xuan-hui, LU Yan-jie , ZHANG Xiao-yong (1. Institute of Powder Metallurgy, University of Science and Technology Beijing, Beijing 100083, China; 2. General Research Institute for Nonferrous Metals, Beijing 100088, China) |
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| Abstract: | AlN ceramic and kovar alloy had been brazed using Ag-Ti3 active alloy in the vacuum condition. SEM-EDX, XRD and EBSD analyzed the microstructure and phases of bonding area. The bonding strength was measured, and the microstructure and phases of sheared surface were analyzed. It was found that a good performance could be got at temperature of 1240 K under vacuum, and the bending strength and the shear strength were σb = 205. 89 MPa and στ=176.10 MPa, respectively. The results are very useful to the broad application of these two materials in the micro-electronics fields. |
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| Keywords: | Ti-Ag active alloy Active brazing Microstructure Bonding strength |
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