Synthesis of aromatic amine curing agent containing non-coplanar rigid moieties and its curing kinetics with epoxy resin |
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Authors: | Jing Qin Guoping Zhang Rong Sun Chingping Wong |
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Institution: | 1. Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China 2. College of Materials Science and Engineering, Shenzhen University, Shenzhen, China 3. Department of Electronic Engineering, Faculty of Engineering, The Chinese University of Hong Kong, Hong Kong, China
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Abstract: | A kind of aromatic diamine, 4′, 4″-(2, 2-diphenylethene-1, 1-diyl)dibiphenyl-4-amine (TPEDA), was successfully synthesized via Suzuki coupling reaction. The TPEDA containing nonplanar rigid moieties can be used as epoxy resins curing agent to improve the complex properties of cured composites. The curing kinetics during thermal processing of E51/TPEDA system was investigated by nonisothermal differential scanning calorimeter. The average activation energy (E α), pre-exponential factor (lnA), and reaction order (n) calculated from the Kissinger, the Ozawa, the Friedman and the Flynn–Wall–Ozawa methods were 55.8 kJ mol?1, 9.4 s?1 and 1.1, respectively. By the aid of estimated kinetic parameters, the predicted heat generation vs temperature curves fit well with the experimental data, which supported the validity of the estimated parameters and the applicability of the analysis method used in this work. By the introduction of nonplanar rigid moieties, the cured epoxy resins with TPEDA exhibited a higher glass transition temperature (T g = 258 °C), good thermal stability (≈395 °C at 10 % mass-loss), and high char yield (36.6 % at 700 °C under nitrogen) compared with conventional curing agents. |
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