Photothermoelastic investigation of stresses around a hole in a plate subjected to thermal shock

This paper contains a three-dimensional photothermoelastic study of stresses generated around the edge of a hole in a flat unrestrained plate subjected to a thermal shock uniformly applied to one face of the plate. The approach taken is experimental in nature, utilizing a newly developed three-dimensional, non-destructive photoelastic technique. An extrapolation procedure is formulated in order to determine transient fringe orders at the thermally shocked surface. For the case considered, the thermal-stress-concentration factor at the edge of the hole was found to be 1.28. Paper was presented at 1964 SESA Annual Meeting held in Cleveland, Ohio, on October 28–30. Work reported herein was conducted by the Douglas Missile and Space Systems Division under company sponsored Research and Development funds.