| 波峰焊及再流焊无铅焊点组织演变规律的研究 |
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| 引用本文： | 戚琳,赵杰,王来,杨富华,尹松鹤.波峰焊及再流焊无铅焊点组织演变规律的研究[J].电子工艺技术,2004,25(2):64-67. |
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| 作者姓名： | 戚琳 赵杰 王来 杨富华 尹松鹤 |
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| 作者单位： | 1. 大连理工大学,辽宁大连,116024
2. 大连中国华录松下电子信息有限公司,辽宁大连,116023 |
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| 摘 要： | 以电子封装线上的波峰焊无铅焊点Sn-0.7Cu/Cu、回流焊无铅焊点Sn-3Ag-0.5Cu/Cu为对象,研究了150 ℃时效过程中无铅焊点处金属间化合物(IMC)、焊料合金组织的演化规律及界面处金属间化合物生长的动力学.试验结果表明:两种无铅焊点处IMC层的厚度随着时效时间的延长而增加,IMC层的生长基本上符合抛物线规律,因此IMC层的长大受元素扩散控制;且两种无铅焊点处IMC层的生长速率常数相近,但Sn-0.7Cu焊料中Sn的晶粒尺寸较Sn-3Ag-0.5Cu中的大;长期时效后,在试样的IMC层内发现有孔洞产生.
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| 关 键 词： | 无铅钎料 时效 组织演变 |
| 文章编号： | 1001-3474(2004)02-0064-04 |
| 修稿时间： | 2003年11月1日 |
Microstructure Evolution in Lead-free Solder Joints After Wave Soldering and Reflow Soldering |
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| QI Lin,ZHAO Jie,WANG Lai,YANG Fu-hua,YIN Song-he.Microstructure Evolution in Lead-free Solder Joints After Wave Soldering and Reflow Soldering[J].Electronics Process Technology,2004,25(2):64-67. |
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| Authors: | QI Lin ZHAO Jie WANG Lai YANG Fu-hua YIN Song-he |
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| Institution: | QI Lin~1,ZHAO Jie~1,WANG Lai~1,YANG Fu-hua~1,YIN Song-he~2 |
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| Abstract: | The effect of aging on the microstructure evolution and IMC growth kinetic of lead-free Sn-0.7Cu/Cu, Sn-3Ag-0.5Cu/Cu solder joints which come from real products was investigated.The results indicated that:the thickness of IMC increased with the aging time. The relationship between the thickness and the aging time of the two kinds of solder joints were according with the rule of parabola,namely the rate of atom diffusion affected the velocity of IMC growth.The value of IMC growth rate of the two kinds of solders were similar.The grain size of Sn in Sn-0.7Cu solder was larger than that in Sn-3Ag-0.5Cu.After long time aging,cavities were observed in the IMC layer. |
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| Keywords: | lead-free solder Aging Microstructure |
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