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基于BP神经网络的模塑封电子器件优化设计
引用本文:蔡苗,杨道国.基于BP神经网络的模塑封电子器件优化设计[J].电子元件与材料,2009,28(8).
作者姓名:蔡苗  杨道国
作者单位:桂林电子科技大学,机电工程学院,广西,桂林,541004
基金项目:国家自然科学基金资金资助项目(No.60666002);;广西研究生教育创新计划资助项目(No.2008105950802M402)
摘    要:针对塑封SOT(小外形晶体菅)器件的使用失效案例,从芯片设计角度出发,提出一种优化设计方法,该方法利用误差反向传播神经网络(BPNN),结合主成分分析(PCA)、遗传算法(GAs)及均匀设计的针对非线性系统的优化设计,设计了该塑封SOT器件的尺寸参数。结合实验和有限元模拟分析,验证该优化设计结果的有效性。结果表明,优化设计的器件各关键界面点的最大应力约减少了70~180MPa,器件的界面层裂现象得到消除,提高了器件的可靠性。

关 键 词:电子模塑封器件  优化设计  误差反向传播神经网络

Optimal design of plastic electronic packaging component based on BP neural network
CAI Miao,YANG Daoguo.Optimal design of plastic electronic packaging component based on BP neural network[J].Electronic Components & Materials,2009,28(8).
Authors:CAI Miao  YANG Daoguo
Institution:School of Mechanical and Electrical Engineering;Guilin University of Electronic Technology;Guilin 541004;Guangxi Zhuangzu Zizhiqu;China
Abstract:According to failure cases of plastic electronic packaging component SOT in the use, dimension parameters of plastic electronic packaging component SOT were designed with a proposed optimal design method, which combined error back-propagation neural network (BPNN), principal component analysis (PCA), genetic algorithms (GAs) and uniform design, and an optimal design for nonlinear system. The validity of optimal design result was verified by combining with experiments and FEA. The results show that the max s...
Keywords:plastic electronic packaging component  optimal design  error back-propagation neural network  
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