Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis |
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| Authors: | Myong Jae Yoo Sang Hyun Kim Woo Sung Lee Jae-Hong Choi |
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| Affiliation: | a Electronic Materials & Device Research Center, Korea Electronics Technology Institute, Seongnam 463-816, Republic of Korea
b Department of Materials Science and Engineering, Korea University, Seoul 136-701, Republic of Korea |
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| Abstract: | Curing reactions of three cycloaliphatic epoxy resins with methyltetrahydrophthalic anhydride (MTHPA) was investigated by differential scanning calorimetry at different heating rates. Activation energy was calculated based on Kissinger method and varied in the range of 67-72 kJ/mol depending on sample. The curing kinetic behavior was well described by Sestak-Berggren (SB) model and the order of the curing reaction is observed to be from 0.02 to 2.11 according to sample. |
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| Keywords: | Cure kinetics Cycloaliphatic epoxy resin Differential scanning calorimetry Activation energy |
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