The chemical passivation of copper in ammonia solutions containing chlorine ions |
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| Authors: | V. I. Larin E. B. Khobotova V. V. Datsenko M. A. Dobriyan |
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| Affiliation: | (1) Karazin Kharkov National University, Kharkov, Ukraine |
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| Abstract: | It was shown that the CuCl layers deposited on copper chemically and electrochemically from copper-ammonia solutions were different. The layer formed chemically was loose, and that formed on the anode, dense. During multilayer copper passivation, the chemically deposited CuCl layer interfered with the formation of electrochemical CuCl and Cu2O layers. |
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