首页 | 本学科首页   官方微博 | 高级检索  
     

磁头内置DFH控制元件可靠性的有限元分析
引用本文:肖祥慧,彭敏放,黎福海,詹杰,唐荣军. 磁头内置DFH控制元件可靠性的有限元分析[J]. 电子学报, 2012, 40(10): 2140-2144. DOI: 10.3969/j.issn.0372-2112.2012.10.040
作者姓名:肖祥慧  彭敏放  黎福海  詹杰  唐荣军
作者单位:1. 湖南大学电气与信息工程学院,湖南长沙,410082
2. 湖南科技大学物理学院,湖南湘潭,411201
3. 日本TDK集团,广东东莞,523000
基金项目:国家自然科学基金,湖南省自然科学基金,湖南省学位与研究生教育教改资金
摘    要: 磁头内置DFH控制元件的可靠性设计评估十分重要,目前工艺上多采用经验数据指导的方法,误差十分大,理论上是根据传统流体力学的基本原理,利用Matlab软件实现模拟评估的,由于元件尺寸限制,模拟算法会随着舍入误差的叠加而失效.本文使用ANSYS软件,通过实验获得建立模型的基本参数,选择了合适的单元类型、材料属性,给出了磁头的有限元模型.利用模型对元件进行的寿命预测实验表明,有限元模型分析DFH控制元件的设计可靠性问题是有效的,并且得出以下结论:在50Ω的新型DFH计算结果中,其热效应强度比传统屏蔽层大10%以上,实际的寿命失败样品问题区域都在线路的转角处.

关 键 词:DFH  可靠性分析  有限元  热效应  电流拥挤效应
收稿时间:2011-12-17

The Finite Element Analysis for Reliability of Built-DFH in Magnetic Head
XIAO Xiang-hui , PENG Min-fang , LI Fu-hai , ZHAN Jie , TANG Rong-jun. The Finite Element Analysis for Reliability of Built-DFH in Magnetic Head[J]. Acta Electronica Sinica, 2012, 40(10): 2140-2144. DOI: 10.3969/j.issn.0372-2112.2012.10.040
Authors:XIAO Xiang-hui    PENG Min-fang    LI Fu-hai    ZHAN Jie    TANG Rong-jun
Affiliation:1. Institute of Elec and Information Engineering in Hunan University, Changsha, Hunan 410082, China;2. School of Physics in Hunan University of Science & Technology, Xiangtan, Hunan 411201, China;3. Japan's TDK Groups, Dongguan, Guangdong 523000, China
Abstract:The assessment for the reliability design of Built-DFH in Magnetic head is very important.It recurrently uses the empirical data to instruct the production in the craft now.Unfortunately,the error is very large.Theoretically,everybody is simulating the reliability using the Matlab software.Owing to the limit of the cell size,the simulation algorithm will expire along with the rounding error superimposition.This article uses the ANSYS software.The experiment was to establish the basic parameters and select the appropriate cell type,material properties and give the finite element model of the head.The results according to the life prediction using the model above shows,the finite element model is effective.Furthermore,in new DFH in 50Ω,the strength of thermal effects is larger above 10% than the traditional shield.The regions with problems of the actual life failed samples are in the line of the corner.
Keywords:Dynamic Flying Height  reliability analysis  finite element  thermal effects  current crowded effect
本文献已被 万方数据 等数据库收录!
点击此处可从《电子学报》浏览原始摘要信息
点击此处可从《电子学报》下载免费的PDF全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号