| 全自动键合机工艺调试方法 |
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| 引用本文： | 潘峰,颜向乙,郑轩,广明安,王丰. 全自动键合机工艺调试方法[J]. 电子工业专用设备, 2009, 38(5): 46-50 |
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| 作者姓名： | 潘峰 颜向乙 郑轩 广明安 王丰 |
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| 作者单位： | 中国电子科技集团公司第四十五研究所,北京东燕郊,101601 |
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| 摘 要： | 介绍新型金球键合机工艺调试过程，分析并解决调试过程中遇到的工艺问题。
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| 关 键 词： | 工艺 键合 调试 |
Process Debugging of Full Automatic Wire Bonder |
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| PAN Feng,YAN Xiangyi,ZHENG Xu'an,GUANG Mingan,WANG Feng. Process Debugging of Full Automatic Wire Bonder[J]. Equipment for Electronic Products Marufacturing, 2009, 38(5): 46-50 |
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| Authors: | PAN Feng YAN Xiangyi ZHENG Xu'an GUANG Mingan WANG Feng |
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| Affiliation: | PAN Feng,YAN Xiangyi,ZHENG Xuan,GUANG Ming'an,WANG Feng (The 45th Research Institute Of CETC,East Yanjiao,Beijing,101601 China) |
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| Abstract: | The article introduced the process adjustment of New Gold Ball Wire Bonder, analyzed and solved the process problems that encountered in debugging. |
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| Keywords: | Process Wire Bond Adjustment |
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