| 树脂封装在微波多芯片组件中的应用研究 |
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| 引用本文： | 张兆华,吴金财,王峰.树脂封装在微波多芯片组件中的应用研究[J].微波学报,2012,28(S1):470-473. |
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| 作者姓名： | 张兆华 吴金财 王峰 |
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| 作者单位： | 南京电子技术研究所，210039 |
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| 摘 要： | 本文深入分析了环氧树脂在微波频段与陶瓷单层电路进行叠层塑封的可行性，并研究了环氧树脂基叠层工艺对基板微波传输性能的影响，进而研究了层与层之间的垂直互连结构形式。
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| 关 键 词： | 树脂封装 微波多芯片组件 垂直过渡 低噪声放大器 |
Research of Epoxy Resin Package for Microwave MCMs |
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| ZHANG Zhao-hu,WU Jin-cai,WANG feng.Research of Epoxy Resin Package for Microwave MCMs[J].Journal of Microwaves,2012,28(S1):470-473. |
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| Authors: | ZHANG Zhao-hu WU Jin-cai WANG feng |
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| Institution: | Nanjing Research Institute of Electronics Technology, Nanjing 210039, China |
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| Abstract: | In this paper, the feasibility of epoxy resin stacked package for ceramic thin film circuits in microwave band is
analyzed. Meanwhile, the impact of epoxy resin stacked package for microwave transmission line is presented. Finally, the
vertical transition for epoxy resin package is also proposed. |
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| Keywords: | epoxy resin package MMCM Vertical transition LNA |
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