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Numerical and experimental analysis of a heat-pipe-embedded printed circuit board for solid state lighting applications
Authors:Thamer Khalif Salem  Ferina Saati Khosroshahi  Mehmet Ar?k  Mohammad O Hamdan  Mete Budakli
Institution:1. Department of Mechanical Engineering, Ozye?in University, Istanbul, Turkey;2. Mechanical Engineering Department, Technical University of Munich, Munich, Germany;3. Mechanical Engineering Department, United Arab Emirates University, Abu Dhabi, UAE;4. Department of Mechanical Engineering, TGU - Turkish-German University, Istanbul, Turkey
Abstract:
Keywords:Heat pipe  embedded heat pipe  thermal conductivity  printed circuit board  electronics cooling
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