Large-area unmodified superhydrophobic copper substrate can be prepared by an electroless replacement deposition |
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Authors: | Song Wei Zhang Jianjun Xie Yunfei Cong Qian Zhao Bing |
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Affiliation: | Key Laboratory of Supramolecular Structure and Materials of Ministry of Education, Jilin University, 2699#, Qianjin Street, Changchun 130012, PR China. |
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Abstract: | Using an electroless replacement deposition method, large-area superhydrophobic metal substrate could be obtained. The superhydrophobic surfaces were prepared via a replacement reaction between copper substrate and HAuCl(4) solution. The roughness of the copper substrate increased much after the replacement reaction. X-ray powder diffraction (XRD) pattern and energy dispersive X-ray (EDX) spectroscopy have proved that gold, CuCl and Cu(2)O formed on the surface of copper substrate after the replacement reaction. The surface showed remarkable superhydrophobic properties with a contact angle higher than 150 degrees without any modification with a self-assembled monolayer (SAM) of long chain thiol or perfluoro molecules. |
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