| Sn-Ag(Cu)合金熔体的电阻率-温度行为 |
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| 引用本文： | 刘永驰,吴金寿,陈杰,毛丽娜,胡成明,刘明全,祖方遒.Sn-Ag(Cu)合金熔体的电阻率-温度行为[J].中国科学技术大学学报,2011(6):535-539,555. |
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| 作者姓名： | 刘永驰 吴金寿 陈杰 毛丽娜 胡成明 刘明全 祖方遒 |
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| 作者单位： | 合肥工业大学材料科学与工程学院;厦门兴才职业技术学院机电系; |
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| 基金项目： | 安徽省自然科学基金(070414178); 国家自然科学基金(50571033)资助 |
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| 摘 要： | 以电阻率法探索了Sn-Ag(Cu)系无铅焊料诸多合金熔体的电阻率-温度行为及变化规律.结果表明,该系合金熔体电阻率随温度在某些温度区域发生异常变化,提示熔体结构状态发生改变.此外,Cu及Ag成分的微量改变,既影响异常区的温度范围,又影响电阻率-温度行为特征.还从化学短程序消散及重组的角度分析了有关异常行为.
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| 关 键 词： | 电阻率-温度行为 液体状态 转变特征 Sn-Ag(Cu)合金 |
Resistivity-temperature behaviors of liquid Sn-Ag(Cu) alloys |
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| LIU Yongchi,WU Jinshou,CHEN Jie,MAO Lina,HU Chengming,LIU Mingquan,ZU Fangqiu.Resistivity-temperature behaviors of liquid Sn-Ag(Cu) alloys[J].Journal of University of Science and Technology of China,2011(6):535-539,555. |
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| Authors: | LIU Yongchi WU Jinshou CHEN Jie MAO Lina HU Chengming LIU Mingquan ZU Fangqiu |
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| Institution: | LIU Yongchi1,WU Jinshou2,CHEN Jie1,MAO Lina1,HU Chengming1,LIU Mingquan1,ZU Fangqiu1(1.College of Materials Science and Engineering,Hefei University of Technology,Hefei 230009,China,2.Dept.of Mechanical Engineering,Xiamen Xingcai College,Xiamen 361024,China) |
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| Abstract: | Temperature dependence of electrical resistivities of liquid Sn-Ag(Cu) lead-free alloys with different components was explored by conducting resistivity experiments.Anomalous changes in some temperature intervals indicated the existence of liquid structural transformation in the melt above liquidus.In addition,for the anomalous transitions,the temperature ranges and the changing characteristics vary with different contents of Cu and Ag in Sn-Ag-Cu ternary melts.The electronic resistivity-temperature anomalo... |
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| Keywords: | resistivity-temperature behavior liquid structural pattern changing characteristic Sn-Ag(Cu) melt |
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