Effect of annealing temperature on the decomposition of reactively sputtered Ag2Cu2O3 films |
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Authors: | C. Petitjean |
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Affiliation: | Institut Jean Lamour (UMR CNRS 7198), Département CP2S, Ecole des Minces, Nancy Université, Parc de Saurupt, CS 14234, 54042 Nancy cedex, France |
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Abstract: | Ag2Cu2O3 films were deposited on glass substrates by reactive sputtering of a composite silver-copper target. The deposited films were annealed in air at 100, 200 and 300 °C. The structure of the films was studied using X-ray diffraction (XRD), their surface morphology was characterised using scanning electron microscopy (SEM) and their electrical resistivity at room temperature was measured using the four point probe method. The 100 °C annealing did not modify either the film structure or the film morphology. On the other hand, Ag2Cu2O3 films were partially decomposed into Ag and CuO after a 200 °C annealing. The decomposition was complete for a 300 °C annealing. The evolution of the film surface morphology as a function of the annealing temperature was discussed in connection to the evolution of the molar volume of the phases constituting the films. |
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Keywords: | Thin films Reactive sputtering Thermal decomposition Silver-copper oxide Silver grains |
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