Out-of-plane ellipsometry measurements of nanoparticles on surfaces for thin film coated wafer inspection |
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Authors: | Cheng-Yang Liu Tze-An Liu Wei-En Fu |
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Affiliation: | 1. Institute for Spectroscopy of the Russian Academy of Sciences, Fizicheskaya Str., 5, Troitsk, Moscow, 142190, Russia;2. A.V. Rzhanov Institute of Semiconductor Physics, Siberian Branch of the Russian Academy of Sciences, 13 Lavrentieva avenue, Novosibirsk, 630090, Russia;1. Laboratory for Advanced Materials Processing, Empa, Swiss Federal Laboratories for Materials Science and Technology, Feuerwerkerstrasse 39, 3602 Thun, Switzerland;2. Laboratory for Photonic Materials and Characterization, Ecole Polytechnique Fédérale de Lausanne, Station 17, 1015 Lausanne, Switzerland;3. Dipartimento di Scienze Chimiche, Università degli Studi di Catania, and INSTM udr Catania, Viale Andrea Doria 6, 95125 Catania, Italy |
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Abstract: | Measurements of the diameter and size distribution of nanoparticles on wafers are critical parameters in the semiconductor industry, essential to control transistor quality and increase production rate. A goniometric optical scatter instrument (GOSI) has been developed that employs polarized light scattering to make measurements of the diameter and size distribution of nanoparticles on bare and thin film coated wafers. This scatter instrument is capable of distinguishing various types of optical scattering characteristics, which correspond to the diameters of the nanoparticles and thin film thickness, on or near the surfaces using the Mueller matrix calculation in Bobbert and Vlieger (1986) [1]. The experimental results of the GOSI system show good agreement with theoretical predictions for nanoparticles of diameter 100, 200, and 300 nm on wafers coated with thin films of 2, 5, and 10 nm thickness. These results demonstrate that the polarization of light scattered by nanoparticles can be used to determine the size of particulate contaminants on bare and thin film coated silicon wafers. |
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