Buried Ni/Cu(001) interface at the atomic scale |
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Authors: | Meyerheim H L Sander D Negulyaev N N Stepanyuk V S Popescu R Popa I Kirschner J |
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Institution: | Max-Planck-Institut für Mikrostrukturphysik, Weinberg 2, D-06120 Halle, Germany. hmeyerhm@mpi-halle.mpg.de |
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Abstract: | We present a quantitative surface x-ray analysis of the buried Ni/Cu(001) interface structure after deposition of 3 and 5 monolayers of Ni at room temperature. Interface mixing is found where 27+/-10% of top layer Cu atoms are exchanged by Ni. Atomic scale simulations reveal a kinetic pathway for the Ni/Cu-exchange process and explain the observed limited degree of intermixing. A disperse distribution of Ni within the Cu surface with a preferential Ni-Ni separation of 3-4 nearest neighbor distances is determined. |
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