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Relaxations in thermosets. XIX. Dielectric effects during curing of diglycidyl ether of bisphenol-A with a catalyst and the properties of the thermoset
Authors:I Alig  G P Johari
Abstract:Changes in the dielectric permittivity ε′ and loss epsiv;″ during the curing of DGEBA catalyzed by 10 mole % dimethylbenzylamine have been studied from sol to gel to glass formation regions at different temperatures from 323 to 390 K. The ε′ monotonically decreases with time of cure, and ε″ initially decreases by several orders of magnitude and then increases to reach a peak value before finally decreasing to a low value characteristic of the glassy state. The features shift to shorter times and the peak vanishes as the curing temperature is increased. The decrease of ε″ at the initial stage of cure has been analyzed in terms of dc conductivity σ0, which follows a power law, σ0 ∝? (tg–t)x, as well as a new singularity equation, σ0 ∝? exp–B/(t0t)] where tg, x, B, and t0 are empirical constants that vary with the curing temperature; tg is close to the time for gelation; and t0 ≥ time for vitrification. The dielectric properties of the thermoset formed after different periods of cure have been studied from 77 to 325 K. Similar studies of the thermosets formed at different temperatures have been made. Increase in the curing period decreases the heights of both the γ-and α-relaxation peaks and increases their separation, while a β-relaxation peak emerges. Isothermal curing at high temperatures decreases the height of the γ peak to a vanishingly small value and increases that of the β peak from a vanishingly small value. In both the uncured and fully cured states, there is only one sub-Tg relaxation process named γ for the uncured and β for the cured state. These results are discussed in terms of our general physical concepts of local mode motions in an amorphous matrix. © 1993 John Wiley & Sons, Inc.
Keywords:dielectric relaxation  curing kinetics  thermoset
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