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Soluble copolyimides with high modulus and low moisture absorption
Authors:William R Shiang  Edmund P Woo
Abstract:A series of transparent copolyimides were prepared from PMDA-ODPA-TFDB via chemical imidization of the corresponding poly(amic acid)s. Copolyimides containing less than 70% PMDA were completely soluble in DMAc and other amide solvents and gave ductile films with unexpectedly high tensile moduli (up to 8.9 GPa). Water absorption, after boiling in water for 72 h, were less than 1 % for the copolymer with 67% PMDA and less than 0.5% for copolymers with less PMDA. Thermooxidative stability was comparable to a commercial polyimide film up to 325°C. A copolyimide containing 34% PMDA had the best overall properties based on the above tests. Additional evaluations revealed a coefficient of linear expansion of about 6 X 10?6/°C, an essentially frequency independent dielectric constant of 2.8, a dissipation factor of about 0.004–0.01 over the range of 1–1000 kHz, and complete retention of tensile properties after exposure to a humid environment for 16 weeks. A model compound study suggests the probable presence of short blocks in these copolymers. © 1993 John Wiley & Sons, Inc.
Keywords:copolyimides  pyromellitic dianhydride  oxydiphthalic dianhydride  2  2′  -bis(trifluoromethyl)-4  4′  -diaminobiphenyl  synthesis  film  tensile properties  oxidative stability  water absorption  hydrolytic stability  electrical properties  coefficient of linear thermal expansion  block copolymer  blends
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