FT-Raman investigation of the thermal curing of PMDA/ODA polyamic acids |
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Authors: | C. Johnson S. L. Wunder |
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Abstract: | The effect of solvent on the curing reactions of PMDA/ODA polyamic acids has been investigated using Fourier transform (FT)-Raman spectroscopy. Films of different thicknesses were cured by: (1) doctor blading 15% solids solutions onto glass slides, (2) removing all but the bound NMP, and (3) removing all the N-methypyrrolidinone (NMP). The rate of cure and final degree of conversion of the PMDA/ODA polyamic acid to polyimide increased substantially in the presence of NMP, and this effect was attributed to the plasticizing effect of the solvent. Below a critical solvent concentration, which was estimated to be approximately 40% of the NMP concentration in the bound-solvent limit, the rate of imidization slowed down considerably. Comparison of FT-Raman data for PMDA/ODA polyamic acid: (1) in solution in NMP, (2) complexed with NMP in the solid state, and (3) in the solid state after all the NMP had been removed with water, indicated that intermolecular interactions were greatest in the latter case and weakest in solution. Spectra of PMDA/ODA in NMP solution provide strong evidence for binding of NMP to the amide carbonyl in solution. © 1993 John Wiley & Sons, Inc. |
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Keywords: | raman spectroscopy of thermal curing of PMDA/ODA polyamic acids polyamic acid, pyromellitic dianhydride/oxydianiline, thermal curing of |
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