| 铜在3%NaCl溶液中腐蚀行为的光电化学研究 |
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| 引用本文： | 任聚杰,杨迈之,童汝亭,郭沁林,蔡生民,周国定.铜在3%NaCl溶液中腐蚀行为的光电化学研究[J].物理化学学报,1994,10(5):452-455. |
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| 作者姓名： | 任聚杰 杨迈之 童汝亭 郭沁林 蔡生民 周国定 |
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| 作者单位： | Department of Chemistry, Hebei University 050016; Department of Chemistry, Peking Univeristy 100871; Department of Thermal Power Engineering, Shanghai Institute of Electric Power 200090 |
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| 摘 要： | Cu以其优异的导电性、导热性和易加工性广泛用于工农业生产中．自然Cu的腐蚀和防腐成为人们很关注的问题．人们已经注意到，Cl-对Cu的腐蚀有影响，并进行过一些研究．但目前使用光电化学方法研究这一问题的文章尚不多见，特别是利用测量开路光电压及其瞬态波形这一现场的、无损的、灵敏的监测方法研究户对Cu电极腐蚀全过程的文章尚未见到．本文正是利用如上方法及XPS，AES方法，研究了Cl-对Cu电极腐蚀的全过程，取得了一些有意义的结果．1实验方法Cu电极用99．99％（质量分数）的Cu制成，面积约为39mm2；电极底部由Cu导线焊接引出，…
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| 关 键 词： | Cu 光电流(Iph) 开路光电压(Voph) Cl- |
| 收稿时间： | 1992-10-20 |
| 修稿时间： | 1993-03-22 |
Photoelectrochemical Study on the Corrosion Behavior of Copper in 3% NaCl Solution |
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| Ren Jujie ,Yang Maizhi ,Tong Ruting, Guo Qinlin, Cai Shengmin, Zhou Guoding.Photoelectrochemical Study on the Corrosion Behavior of Copper in 3% NaCl Solution[J].Acta Physico-Chimica Sinica,1994,10(5):452-455. |
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| Authors: | Ren Jujie Yang Maizhi Tong Ruting Guo Qinlin Cai Shengmin Zhou Guoding |
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| Institution: | Department of Chemistry, Hebei University 050016; Department of Chemistry, Peking Univeristy 100871; Department of Thermal Power Engineering, Shanghai Institute of Electric Power 200090 |
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| Abstract: | The corrosion behavior of copper in 3% NaCl solutions has been investigated using AES. XPS and photoelectrochemical tectniques. The results show that Cl- has remarkable influence on the corrosion behavior of copper. With the increasing immersion time, the photoresponse of copper electrode changes from p-type to n-type gradually, and the invasion degree of Cl- ions on copper electrode increases. Finally, the band gap of the sedriconduct film formed on copper electrode surface is 1 .7eV. |
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| Keywords: | Cu Photocurrent (I_(ph)) Open circult photovoltage (V_(oph)) Cl |
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