Influence of some additional elements on the surface tension of copper at intermediate and high temperatures

The influence of some additional elements on the surface tension of copper at intermediate and high temperatures was measured. In the intermediate temperature range (~0.4 T_m) the voids annealing technique was used with thoroughly outgassed copper samples, implanted with He, O₂, S and Kr before irradiation with 500 keV Cu⁺ ions, in the swelling peak temperature region. In the high temperature range (~0.9 T_m) the zero creep rate technique was used to check the influence of environmental He and Si on the surface tension of bamboo-structure wires. These experiments were made with a versatile and original device which allows the strain variations to be followed through those of the electrical resistance at constant volume.