| Sn-3.0Ag-0.5Cu真空再流焊工艺技术研究 |
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| 引用本文： | 高伟娜,胡凤达,陈雅容. Sn-3.0Ag-0.5Cu真空再流焊工艺技术研究[J]. 电子与封装, 2011, 11(8): 15-18 |
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| 作者姓名： | 高伟娜 胡凤达 陈雅容 |
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| 作者单位： | 北京卫星制造厂,北京,100190 |
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| 摘 要： | 为了获得低热阻和解决不同焊接材料之间的热应力匹配问题,大功率DC-DC模块电源产品广泛采用了载体组件作为功率元器件热沉的散热方法。载体组件由金属基板和陶瓷基板焊接而成,为了得到无空洞的焊接界面,载体组件采用了真空再流焊工艺技术。文中从焊料形态、焊接表面处理、真空度等几个方面介绍了载体组件的Sn-3.0Ag-0.5Cu真...
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| 关 键 词： | 真空再流焊 Sn-3.0Ag-0.5Cu焊片 焊点可靠性 |
Reaseach of Vacuum Reflow Soldering with Sn-3.0Ag-0.5Cu Solder |
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| GAO Wei-na,HU Feng-da,CHEN Ya-rong. Reaseach of Vacuum Reflow Soldering with Sn-3.0Ag-0.5Cu Solder[J]. Electronics & Packaging, 2011, 11(8): 15-18 |
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| Authors: | GAO Wei-na HU Feng-da CHEN Ya-rong |
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| Affiliation: | GAO Wei-na,HU Feng-da,CHEN Ya-rong(Beijing Spacecrafts,Beijing100190,China) |
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| Abstract: | In order to obtain low thermal resistance and solve the thermal stress question of different materials,high-power DC-DC converter extensively use substrate-heat sink as the means of power devices cooling.The substrate-heat sink is consists of metal substrate and ceramic substrate.In order to get void-free interface,the substrate-heat sink is soldered with vacuum reflow soldering technology.This paper introduces the process of vacuum reflow soldering technology with Sn-3.0Ag-0.5Cu solder,which is described m... |
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| Keywords: | vaccum reflow soldering Sn-3.0Ag-0.5Cu solder joint reliabilty |
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