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| Ti对Sn0.7Cu无铅钎料润湿性和界面的影响 | |
| 引用本文： | 高洪永,卫国强,罗道军,贺光辉. Ti对Sn0.7Cu无铅钎料润湿性和界面的影响[J]. 电子元件与材料, 2011, 30(10): 40-43 |
| 作者姓名： | 高洪永 卫国强 罗道军 贺光辉 |
| 作者单位： | 1. 华南理工大学机械与汽车工程学院,广东广州510640;工信部电子第五研究所可靠性研究分析中心,广东广州510610 2. 华南理工大学机械与汽车工程学院,广东广州,510640 3. 工信部电子第五研究所可靠性研究分析中心,广东广州,510610 |
| 基金项目： | 国家自然科学基金(NSFC-广东联合)重点资助项目(No.U0734006) |
| 摘 要： | 研究了Ti的加入对Sn0.7Cu无铅钎料润湿性能以及钎料/Cu界面微观组织的影响.结果表明:在Sn0.7Cu中添加微量Ti,提高了钎料的润湿性能,可使铺展面积提高5％左右,当钎焊时间为3s时,界面金属间化合物(IMC)形貌由原来的扇贝状变为锯齿状；随着钎焊时间延长,Sn0.7Cu/Cu和Sn0.7Cu0.008Ti/C... |
| 关 键 词： | Sn0.7Cu钎料 Ti 润湿性 金属间化合物 |
Effects of Ti on wettability and interface of Sn0.7Cu lead-free solder |
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| GAO Hongyong,WEI Guoqiang,LUO Daojun,HE Guanghui. Effects of Ti on wettability and interface of Sn0.7Cu lead-free solder[J]. Electronic Components & Materials, 2011, 30(10): 40-43 | |
| Authors: | GAO Hongyong WEI Guoqiang LUO Daojun HE Guanghui |
| Affiliation: | GAO Hongyong1,2,WEI Guoqiang1,LUO Daojun2,HE Guanghui2(1.School of Mechanical and Automotive Engineering,South China University of Technology,Guangzhou 510640,China,2.The Research and Analysis Center,The 5th Electronics Institute of Industry and Information Technology,MIIT,Guangzhou 510610,China) |
| Abstract: | The effects on the wettability and solders/Cu interfacial microstructures of Sn0.7Cu lead-free solder by adding Ti were investigated.Results show that the wettability is improved,the spreading area is increased by 5%,the morphologies of interfacial intermetallic compound(IMC) change from scallop-shaped to serration at 3 s of soldering duration.With the increase of soldering time,the thicknesses of Sn0.7Cu/Cu and Sn0.7Cu0.008Ti/Cu interfacial IMC layers increase accordingly,the pattern of IMC changes to lath... |
| Keywords: | Sn0.7Cu solder Ti wettability intermetallic compound |
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