| Abstract: | The thermomechanical properties of octafunctional cubic silsesquioxane‐modified epoxy resins associated with dicycloaliphatic hardener (4,4′‐dimethyldiaminodicyclo hexyl methane) were studied using thermogravimetric analysis, differential scanning calorimetry, and dynamic mechanical analysis. The structures of epoxy resin containing cubic silsesquioxane epoxides were characterized by Fourier transform infrared spectroscopy and wide‐angle X‐ray scattering techniques. In this work, octa(dimethylsiloxybutylepoxide) octasilsesquioxane (OB), and octa(glycidyldimethyl‐siloxyepoxide) octasilsesquioxane (OG), were synthesized and used as additives to improve the properties of a commercial epoxy resin by exploring the effects of varying the ratio of OB or OG. The commercial Ciba epoxy resin (Araldite LY5210/HY2954) was used as a standard. It was found, by thermogravimetric analysis and dynamic mechanical analysis, that the highest thermal stability was observed at N = 0.5 (N = number of amine groups/number of epoxy rings). No glass transition temperature was observed by adding 20 mol % OB to the Ciba epoxy resin, indicating the reduction of chain motion in the presence of octafunctional cubic silsesquioxane epoxide. The storage modulus of the OB‐modified epoxy resin also increased, especially at higher temperatures, compared with the Ciba epoxy resin under identical curing conditions. Fourier transform infrared data elucidated the preservation of cubic silsesquioxane structure after curing at high temperature. In contrast, the OG/Araldite LY5210/HY2954 systems gave poorer thermomechanical properties. The low viscosity of OB at room temperature (～ 350 cPs) makes it suitable for composite processing and, when used in conjunction with the Ciba epoxy, lowers the viscosity of this system as well. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3490–3503, 2004 |
