| 考虑硅通孔的三维集成电路热传输解析模型 |
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| 引用本文： | 朱樟明,左平,杨银堂.考虑硅通孔的三维集成电路热传输解析模型[J].物理学报,2011,60(11):118001-118001. |
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| 作者姓名： | 朱樟明 左平 杨银堂 |
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| 作者单位： | 西安电子科技大学微电子学院,西安 710071 |
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| 基金项目： | 中国工程物理研究院科学技术发展基金重点课题(批准号:2007A05001)和中国工程物理研究院电子工程研究所科技创新基金(批准号:S20070202)资助的课题. |
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| 摘 要： | 基于不考虑硅通孔的N层叠芯片的一维热传输解析模型,提出了硅通孔的等效热模型,获得了考虑硅通孔的三维集成电路热传输解析模型,并采用Matlab软件验证分析了硅通孔对三维集成电路热管理的影响.分析结果表明,硅通孔能有效改善三维集成电路的散热,硅通孔的间距增大将使三维集成电路的温升变大.
关键词：
三维集成电路
热管理
硅通孔
等效热模型
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| 关 键 词： | 三维集成电路 热管理 硅通孔 等效热模型 |
| 收稿时间： | 7/3/2010 12:00:00 AM |
An analytical thermal model for 3D integrated circuit considering through silicon via |
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| Zhu Zhang-Ming,Zuo Ping and Yang Yin-Tang.An analytical thermal model for 3D integrated circuit considering through silicon via[J].Acta Physica Sinica,2011,60(11):118001-118001. |
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| Authors: | Zhu Zhang-Ming Zuo Ping and Yang Yin-Tang |
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| Institution: | Institute of Electronic Engineering,China Academy of Engineering Physics,Mianyang 621900,China;Institute of Electronic Engineering,China Academy of Engineering Physics,Mianyang 621900,China;Institute of Electronic Engineering,China Academy of Engineering Physics,Mianyang 621900,China;Institute of Electronic Engineering,China Academy of Engineering Physics,Mianyang 621900,China;Institute of Electronic Engineering,China Academy of Engineering Physics,Mianyang 621900,China |
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| Abstract: | Based on the one-dimensional analytical thermal model for N strata stacked chips without through-silicon via (TSV),the equivalent thermal model for TSV is presented in this paper.And then,the corresponding analytical thermal model with considering TSV is deriveed.Finally,Matlab software is used to verify and analyze the influence of TSV on the thermal management of 3D IC intergration.The analysis results indicate that the TSV can effectively improve the heat dissipation of 3D IC circuits,and the increase of... |
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| Keywords: | laser-driven flyer laser irradiation optical fiber array probe laser plasma |
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