| OSP工艺与应用 |
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| 引用本文： | 羊秋福,辛建树.OSP工艺与应用[J].印制电路信息,2006(3):43-45. |
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| 作者姓名： | 羊秋福 辛建树 |
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| 作者单位： | 恩森化学有限公司,318020 |
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| 摘 要： | 随着环保领域对电子产品的要求,OSP将成为PCB表面涂覆的趋势。本文就OSP工艺应用、维护及检测进行了阐述。
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| 关 键 词： | 有机助焊保护膜 |
OSP Process and Application |
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| Yang Qiufu,Xin Jianshu.OSP Process and Application[J].Printed Circuit Information,2006(3):43-45. |
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| Authors: | Yang Qiufu Xin Jianshu |
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| Institution: | Yang Qiufu Xin Jianshu |
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| Abstract: | With the requisition for electronic product of the environmental protection field, OSP will become the trend of surface coating of PCB. This text has been explained on OSP process is used, maintained and measured. |
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| Keywords: | organic solderability preservatives |
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