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Tunable dielectric thin films by aqueous, inorganic solution-based processing
Authors:Matti Alemayehu  John Evan Davis  Milton Jackson  Brian Lessig  Logan Smith  Jon David Sumega  Chris Knutson  Matt Beekman  David C. Johnson  Douglas A. Keszler
Affiliation:aDepartment of Chemistry, University of Oregon, Eugene, OR 97403, United States;bDepartment of Chemistry, Oregon State University, Corvallis, OR 97331, United States
Abstract:Sub-micron, nanolaminated, dielectric thin films comprised of amorphous aluminum oxide phosphate (AlPO) and hafnium oxide sulfate (HafSOx) layers were fabricated in open-air conditions from aqueous inorganic precursors by spin coating with minimal thermal processing. These nanolaminated thin film insulators display an averaging effect of effective dielectric permittivity in devices with controlled AlPO:HafSOx thickness ratios, enabling tunable dielectric properties. X-ray reflectivity measurements were used to characterize film thickness, smoothness, and uniformity. Scanning electron microscopy was used to analyze final nanolaminated devices. Electrical characterization of metal-insulator-insulator-metal capacitors revealed tunable relative dielectric constants ranging from approximately 5–10 with loss tangents less than 2% at 10 kHz in devices with approximately 300 nm total dielectric thickness. The results suggest a simple, inexpensive processing approach for fabricating devices that require insulating layers with specific dielectric properties.
Keywords:Tunable dielectric permittivity   Thin film   Aqueous solution deposition   Prompt inorganic condensation   Nanolaminate   Spin coating
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