Heat transfer and pressure drop in fractal microchannel heat sink for cooling of electronic chips |
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| Authors: | Shutian Liu Yongcun Zhang Peng Liu |
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| Institution: | (1) State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, 116024, People’s Republic of China |
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| Abstract: | In this paper, the improved design of fractal branching channel net that can meet the demand for cooling of rectangular electronic
chip with arbitrary ratio of length to width is presented. A theory model is proposed that can be used to estimate the performance
of heat transfer and pressure drop approximately. It is found that the optimal total branching level is 7 and the ratio of
length to width is 1.87 at the fixed cooling surface for fractal microchannel heat sink. |
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