A new unified constitutive model with short- and long-range back stress for lead-free solders of Sn–3Ag–0.5Cu and Sn–0.7Cu 期刊界 All Journals 搜尽天下杂志传播学术成果专业期刊搜索期刊信息化学术搜索

A new unified constitutive model with short- and long-range back stress for lead-free solders of Sn–3Ag–0.5Cu and Sn–0.7Cu

摘要：
收稿时间：	2008-07-17
修稿时间：	2009-02-19
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