H processing of copper surfaces

Changes in the crystallographic structure of polycrystalline copper surface due to the atomic hydrogen treatment are described. Samples of polycrystalline OFHC copper plates were exposed to a flux of thermal hydrogen atoms with the density between 1×10²¹ atoms/m²s and 1×10²³ atoms/m²s. Hydrogen atoms partially accommodate and recombine in the potential well on the surface. During these processes copper atoms on the surface displace, which leads to a recrystallization of the samples. The effects were investigated by a scanning electron microscope (SEM).