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H processing of copper surfaces |
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| Authors: | M Mozetič M Kveder T Mozetič M Drobnič |
| Institution: | 1. Institute of Electronics and Vacuum Technology, Teslova 30, 61000, Ljubljana, Slovenia 2. Secondary Health School, Ipav?eva 10, 6300, Celje, Slovenia 3. Institut Jozef Stefan, Jamova 39, 6100, Ljubljana, Slovenia |
| Abstract: | Changes in the crystallographic structure of polycrystalline copper surface due to the atomic hydrogen treatment are described. Samples of polycrystalline OFHC copper plates were exposed to a flux of thermal hydrogen atoms with the density between 1×1021 atoms/m2s and 1×1023 atoms/m2s. Hydrogen atoms partially accommodate and recombine in the potential well on the surface. During these processes copper atoms on the surface displace, which leads to a recrystallization of the samples. The effects were investigated by a scanning electron microscope (SEM). |
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