| 无氰溶液中电沉积铜锡合金电化学行为的研究 |
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| 引用本文： | 左正忠,何细华,侯润香. 无氰溶液中电沉积铜锡合金电化学行为的研究[J]. 武汉大学学报(理学版), 1996, 0(2) |
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| 作者姓名： | 左正忠 何细华 侯润香 |
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| 作者单位： | 武汉大学化学系 |
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| 摘 要： | 运用循环伏安法，研究了无氰电沉积铜锡合金溶液中Ｃｕ、Ｓｎ的单独电沉积及其它们共电沉积的电化学行为．结果表明：无论在含有络合剂或不含有络合的溶液中，Ｃｕ，Ｓｎ及Ｃｕ－Ｓｎ合金的电化学行为均为不可逆的电化学反应．
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| 关 键 词： | 电沉积，铜锡合金，循环伏安法 |
STUDIES ON THE ELECTROCHEMICAL BEHAVIORS OF ELECTRODEPOSITING COPPER-TIN ALLOY FROM NONCYANIDE BATH |
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| Zuo Zhengzhong, He Xihua, Hou Runxiang. STUDIES ON THE ELECTROCHEMICAL BEHAVIORS OF ELECTRODEPOSITING COPPER-TIN ALLOY FROM NONCYANIDE BATH[J]. JOurnal of Wuhan University:Natural Science Edition, 1996, 0(2) |
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| Authors: | Zuo Zhengzhong He Xihua Hou Runxiang |
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| Abstract: | Electrochemical behaviors of Copper, Tin and Copper-Tin in electrodepositingCopper-Tin alloy from noncyanide bath have been studied using cyclic voltammetry. The results showed that their electrochemical behaviors were irreversible process in solutions with or without complex agents. |
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| Keywords: | electrodeposition Copper-Tin alloy cyclic voltammetry |
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