| 薄金板可靠性研究及金厚控制 |
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| 引用本文： | 曾红,杨邵波,胡曦.薄金板可靠性研究及金厚控制[J].印制电路信息,2012(8):47-54. |
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| 作者姓名： | 曾红 杨邵波 胡曦 |
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| 作者单位： | 东莞生益电子有限公司,广东东莞,523039 |
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| 摘 要： | 针对沉金工艺的PCB板,研究了板面金厚分布的规律,.时研究了金厚0.03μm产品的可靠性,进而对金厚的0.03μm板的金厚通过统计控制方法计算设定控制限进行控制,已达到成本控制的目的.
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| 关 键 词： | 薄金 金厚分布 可靠性 控制限 |
Research of reliability and gold thickness control in flash gold PCB |
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| ZENG Hong
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YANG Shao-bo
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HU Xi.Research of reliability and gold thickness control in flash gold PCB[J].Printed Circuit Information,2012(8):47-54. |
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| Authors: | ZENG Hong YANG Shao-bo HU Xi |
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| Institution: | ZENG Hong YANG Shao-bo HU Xi |
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| Abstract: | This article focused on the PCB of ENIG process,made research the law of distribution of gold thickness on the board.At the same time,we researched the reliability of PCBs with 0.03 mm gold thickness.And then we set control limit to the Flash Gold PCB’s gold thickness though the method of SPC,in order to achieve the purpose of cost control. |
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| Keywords: | Flash Gold Distribution of Gold Thickness Reliability Control limit |
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