| 表面镀覆层与焊料的界面反应对可靠性的影响 |
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| 引用本文： | 蒋廷彪,周鹏,徐龙会.表面镀覆层与焊料的界面反应对可靠性的影响[J].电子元件与材料,2011,30(3):65-68. |
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| 作者姓名： | 蒋廷彪 周鹏 徐龙会 |
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| 作者单位： | 蒋廷彪,ZHOU Peng,徐龙会(桂林电子科技大学,广西,桂林,541004);周鹏(青岛海信通信有限公司,山东,青岛,266510) |
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| 基金项目： | 国家自然科学基金资助项目 |
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| 摘 要： | 通过对SBGA器件与不同表面镀覆层(OSP,ENIG,HASL和Im-Ag)的PCB板互连形成的SnAgCu焊点在温度循环条件下的可靠性进行研究,对比SnPb焊膏,结合有限元仿真进行分析.结果表明:使用ENIG镀覆层的可靠性最好,SnPb样品的焊点失效率为0.98%,SnAgCu样品只有0.68%.温度循环后SnAgC...
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| 关 键 词： | 表面镀覆层 无铅钎料 可靠性 |
Effect on reliability of interface reaction of surface finishes and solders |
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| JIANG Tingbiao,ZHOU Peng,XU Longhui.Effect on reliability of interface reaction of surface finishes and solders[J].Electronic Components & Materials,2011,30(3):65-68. |
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| Authors: | JIANG Tingbiao ZHOU Peng XU Longhui |
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| Institution: | 1.Guilin University of Electronic Technology,Guilin 541004,Guangxi Zhuangzu Zizhiqu,China;2.Hisense Communications Co.,Ltd,Qingdao 266510,Shandong Province,China) |
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| Abstract: | The reliability of SnAgCu spots to joint SBGA and PCB with different finishes(OSP,ENIG,HASL and Im-Ag) was analyzed under temperature cycle condition and compared with the SnPb solder paste using the finite element simulation analysis.The results show that the joints have the best reliability when using the ENIG finishes,the spot failure rate of SnPb sample is 0.98%,the SnAgCu sample is only 0.68%.The overall strength of the SnAgCu spot is higher than that of the SnPb spot after the temperature cycling,the equivalent plastic strains of the most dangerous spots are 0.016,0.028 on SnAgCu sample and SnPb sample,respectively. |
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| Keywords: | surface finish lead-free solder reliability |
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