残余应力分析方法比较:X射线衍射法与应力释放法

残余应力分析方法主要有衍射法、应力释放法和声、光、磁等方法。其中,X射线衍射法与应力释放中的钻孔技术与理论最为成熟,应用最广。在应力均匀且数值较小时,两者可以给出相互接近的结果。然而当样品微小且微观结构复杂时,两者给出的结果会有明显的差异。本文利用上述两种方法对同一纯铜样品表面的残余应力进行分析,对比分析结果并讨论了相关的影响因素。我们对X射线衍射法与环芯法的适用性进行了讨论:前者适用于晶体材料的无损检测,而后者更能反映当前应力水平。此外,对方法的选用需要考虑应力测试的目的。

Comparison of Residual Stress Analysis Methods: X-Ray Diffraction Method vs Stress Release Method

Residual stress analysis methods can be coarsely cataloged into the following types:diffraction method,stress release method,and sound,light,magnetic method,etc.Among them,X-ray diffraction and hole-drilling technique are two of the most mature and most widely used methods.When the stress is uniform and the value is small,these two methods can give similar results.However,when the sample is small and its microstructure is complex,there will be a significant difference between the results given by both of the mentioned methods.In this paper,residual stress on the surface of the same pure copper sample is analyzed by X-ray diffraction and ring-core method,the analysis results are compared and the related factors are discussed.The applicability of X-ray diffraction method and ring core method is discussed:the former is suitable for crystal material and in non-destructive examination,and the latter is more suitable to reflect current stress level.In addition,the purpose of stress testing should be taken into account in method selection.