| HDI激光成孔技术 |
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| 引用本文： | 陈壹华. HDI激光成孔技术[J]. 印制电路信息, 2006, 0(9): 35-39 |
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| 作者姓名： | 陈壹华 |
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| 作者单位： | 华南师范大学,528225 |
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| 摘 要： | 随着PCB制作技术的高速发展,HDI基板布线密度与孔径分布日趋精密化、微型化,顺应HDI成孔加工技术需要,激光成孔技术在国内得到广泛应用。本文针对我国HDI市场生产需要,从目前各HDI厂商所采用的HDI技术入手,阐述了目前HDI生产中所使用的激光钻孔技术,并就其激光戍孔原理、戍孔技术特征、工艺特性及加工过程等方面进行了分析、对比与探讨。
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| 关 键 词： | 激光 布线密度 孔径 成孔技术 |
Hole Formation Technology by Laser Shooting on HDI |
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| Chen Yihua. Hole Formation Technology by Laser Shooting on HDI[J]. Printed Circuit Information, 2006, 0(9): 35-39 |
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| Authors: | Chen Yihua |
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| Abstract: | Along with rapid progress of manufacturing technology on PCB,it is getting more and more precise and miniature for the circuit layout density and hole-diameter on HDI board so that it can conform a new hole formation technology by laser shooting to meet machining requirement of HDI;and this new technology obtains abroad appli- cation in the nation.Starting with demand of HDI producing in our country and HDI technique adopted by all manufac- turers of PCB now,it is set forth for hole formation techniques in existence by laser shooting in this paper,then its principle,techno-character,craft-peculiarity and machining process etc are analyzed,compared and discussed. |
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| Keywords: | HDI |
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