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EVALUATION OF THERMAL-MECHANICAL FATIGUE BEHAVIOR FOR 62Sn-38Pb BULK SOLDER |
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| Authors: | XS Wang YQ Li SW Yu |
| Institution: | Affiliated with the Department of Engineering Mechanics at Tsinghua University, Beijing, China.;Affiliated with the Department of Engineering Mechanics at Tsinghua University, Beijing, China.;Affiliated with the Department of Mechanical Engineering at University of South Carolina, Columbia, SC. |
| Abstract: | |
| Keywords: | thermal-mechanical coupled loading crack growth stress-strain bulk solder equivalent plastic strain |