| 红外探测器封装技术 |
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| 引用本文： | 仰叶,朱魁章,刘婷,杜文飞. 红外探测器封装技术[J]. 低温与超导, 2010, 38(12) |
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| 作者姓名： | 仰叶 朱魁章 刘婷 杜文飞 |
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| 作者单位： | 中国电子科技集团公司第16研究所; |
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| 摘 要： | 探讨了目前红外探测器的封装工艺,对红外探测器的机械连接、电连接、窗口气密性焊接、引线盘工艺、表面处理工艺这几个关键工艺技术进行了比较深入细致的分析,总结了影响探测器正常工作的主要因素。
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| 关 键 词： | 红外探测器 封装 真空寿命 可靠性 |
Packaging technology of infrared detector |
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| Yang Ye,Zhu Kuizhang,Liu Ting,Du Wenfei. Packaging technology of infrared detector[J]. Cryogenics and Superconductivity, 2010, 38(12) |
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| Authors: | Yang Ye Zhu Kuizhang Liu Ting Du Wenfei |
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| Affiliation: | Yang Ye,Zhu Kuizhang,Liu Ting,Du Wenfei(The 16th Institute of China Electronics Technology Group Corporation,Hefei 230043,China) |
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| Abstract: | The current packaging techniques for ID were discussed.Some key techniques including mechanical connections,circuit connections,the welding for airproof seal of window,techniques for leads panel and surface plishing,were analyzed in details.The major factors to effect ID operation were summarized. |
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| Keywords: | Infrared detector Package Vacuum life Reliability |
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