Adsorption of aqueous Cu(II) and Ag(I) by silica anchored Schiff base decorated polyamidoamine dendrimers: Behavior and mechanism

A class of silica anchored Schiff base decorated polyamidoamine (PAMAM) dendrimers were synthesized for removing aqueous Cu(II) and Ag(I). The adsorption performance was investigated synthetically and the adsorption mechanism was revealed. Results indicate the adsorption capacity depends on dendrimer generation, solution pH, contact time, temperature and initial metal ion concentration. The optimum adsorption pH is 6 for both metal ion. Adsorption kinetic suggests the adsorption can achieve equilibrium at 180 and 150 min for Cu(II) and Ag(I). The kinetic process is found to be in good agreement with pseudo-second-order model and film diffusion is the rate-controlling step. The adsorption isotherm indicates the adsorption is proceeded by monolayer behavior with chemical mechanism. These adsorbents exhibit competitive adsorption capacity as compared with other reported adsorbents. Theoretical calculation demonstrates the participation of hydroxyl, carbonyl, and amide groups during the adsorption of Cu(II), while hydroxyl and amide groups are mainly responsible for capturing Ag(I).