Optimization and characterization of UV-curable adhesives for optical communications by response surface methodology

Novel organic UV-curable material (UCM) containing fluorine and methoxy-silane has been specifically developed for the fabrication of optical-communications systems devices. Response surface methodology (RSM) was used to evaluate the effect of UCM and colloidal silica content in UV-curable adhesive formulations on the refractive index, curing, adhesion strength (dry and wet) and coefficient of thermal expansion (CTE). A central composite design for two variables at five levels was chosen as the experimental design. UCM for all six responses was highly significant and colloidal silica was significant for conversion and adhesion strength (dry and wet). UCM and colloidal silica had significant interactive effects on adhesion strength and CTE. Based on the fitted model, in order to get the optimal conditions for the application of optical adhesives in high-performance optical components, UCM should be set over 20 wt% and colloidal silica be set below 10 wt%.