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Thermal stability and electrical properties of copper nitride with In or Ti |
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| Institution: | [1]Information Engineering School, Hangzhou Dianzi University, Hangzhou 310018, China [2]State Key Laboratory for Surface Physics, Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China [3]School of Sciences, Zhejiang Sci- Tech University, Hangzhou 310018, China |
| Abstract: | |
| Keywords: | ternary nitride thin film thermal stability electrical properties |
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