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Epoxy/polyhedral oligomeric silsesquioxane nanocomposites from octakis(glycidyldimethylsiloxy)octasilsesquioxane and small‐molecule curing agents
Authors:Ying‐Ling Liu  Gung‐Pei Chang  Keh‐Ying Hsu  Feng‐Chih Chang
Abstract:Epoxy/polyhedral oligomeric silsesquioxane (POSS) nanocomposites were obtained from octakis(glycidyldimethylsiloxy)octasilsesquioxane (OG) and diglycidyl ether of bisphenol A cured with small‐molecule curing agents of diethylphosphite (DEP) and dicyandiamide (DICY). An increase in the POSS contents of the nanocomposites and an improvement in the nanocomposite homogeneity were observed with the use of the small‐molecule curing agents. Phosphorus in DEP and nitrogen in DICY also performed synergism with POSS for thermal stability enhancement and flammability improvement in the nanocomposites. The nanocomposites possessing high OG contents exhibited good thermal stability, improved flammability, and high storage moduli. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 3825–3835, 2006
Keywords:curing of polymers  nanocomposites  silicons  crosslinking
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