盐雾腐蚀对不同封装形式集成电路性能的影响

通过分析塑料封装、陶瓷封装、玻璃封装和金属封装集成电路的材料成分,得出它们抵抗盐雾的腐蚀能力。根据市场的使用情况,选用塑封、陶封、玻封三种封装形式的集成电路按照6种不同的试验条件进行盐雾试验。文章通过对试验后的结果进行比较和分析,得出在正常盐雾腐蚀条件下, 它们性能受到影响的大小;在不同盐雾溶液和不同的温度条件下,陶瓷封装电路的性能也发生了变化。最后对塑料封装、陶瓷封装、玻璃封装电路的抗盐雾腐蚀能力进行了总结。

The Saltfog Rusty Influence for Different Package Types of IC's Performance

By analyzing the integrated circuit' s material component of plastic package 、ceramic package、glass package and metal package types, drawing the anti-rusty ability for saltfog. Selecting three package types of IC , plastic package、ceramic package and glass package, making the saltfog test in six conditions at market' s using . drawing the performance influent in normal saltfog test condition by analyzing and compacting the result after testing ; the performance of ceramic package circuit changes in different saltfog liquor and different temperature.Finally summarizing the anti-saltfog rusty ability of plastic package、ceramic package and glass package.