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热丝法氢处理多晶硅锗薄膜
引用本文:张建军,胡增鑫,谷士斌,赵颖,耿新华.热丝法氢处理多晶硅锗薄膜[J].半导体学报,2007,28(3).
作者姓名:张建军  胡增鑫  谷士斌  赵颖  耿新华
作者单位:南开大学光电子研究所,天津市光电子薄膜器件与技术重点实验室,天津,300071
基金项目:天津市自然科学基金,国家自然科学基金,教育部留学回国人员科研启动基金
摘    要:优化了热丝法氢处理多晶硅锗薄膜工艺条件.通过测试材料暗电导的温度特性得出多晶硅锗材料的电导激活能,从而考察氢处理效果.结果表明,采用此技术可有效减少多晶硅锗薄膜中的缺陷态.在优化氢处理时衬底和热丝的温度后,可以把处理时间缩短致30min之内,明显短于其他氢处理技术.

关 键 词:热丝法  氢处理  多晶硅锗

Hydrogenation of Polycrystalline SiGe Thin Films by Hot Wire Technique
Zhang Jianjun,Hu Zengxin,Gu Shibin,Zhao Ying,Geng Xinhua.Hydrogenation of Polycrystalline SiGe Thin Films by Hot Wire Technique[J].Chinese Journal of Semiconductors,2007,28(3).
Authors:Zhang Jianjun  Hu Zengxin  Gu Shibin  Zhao Ying  Geng Xinhua
Abstract:An optimized condition for defect passivation by the hot-wire technique was established. Effects of hydrogenation for polycrystalline SiGe (poly-Si1-xGex) thin films were estimated by investigating the dark conductivity and activation energy that derive from the conductivity as a function of the temperature. The results show that this technique can effectively reduce defects present in poly-Si1-xGex films. By optimizing the substrate and filament temperatures,the treatment can be accomplished in a short time of 20 ~ 30min, which is considerably shorter than other hydrogenation techniques.
Keywords:hot-wire  hydrogenation  polycrystatline SiGe
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