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阻焊桥脱落风险评估及应对研究
引用本文:史宏宇,刘昭亮,罗娜.阻焊桥脱落风险评估及应对研究[J].印制电路信息,2013(11):26-27,58.
作者姓名:史宏宇  刘昭亮  罗娜
作者单位:广州兴森快捷电路科技有限公司,广东广州510063
摘    要:文章主要探讨了阻焊桥能力量化表征方法,在正常生产条件下量化表征阻焊桥设计(桥长、桥宽)与阻焊桥能力的关系,建立数学模型。根据生产能力界定设计参数的合理范围,并可根据数学模型对生产订单的阻焊桥脱落缺陷进行风险评估,筛选出难度订单,给出工程设计及制程工艺优化方案思路。

关 键 词:阻焊桥  桥形参数  数学模型  风险评估

The research of solder bridge fall off risk assessment and response
SHI Hong-yu,LIU Shao-liang,LUO Na.The research of solder bridge fall off risk assessment and response[J].Printed Circuit Information,2013(11):26-27,58.
Authors:SHI Hong-yu  LIU Shao-liang  LUO Na
Institution:SHI Hong-yu LIU Shao-liang LUO Na
Abstract:This paper studied the method for quantitative characterization of the solder bridge process capability, quantitative characterization of solder bridge design parameters (solder bridge length, width) and the process ability of solder bridge under production conditions and built a mathematical model. It defined the acceptable range of design parameters according to tile production capacity and the mathematical model for the production order of defect which drop the solder bridge in risk assessment, and screened out the difficulty order, proposed project design and process engineering optimum proposal.
Keywords:Solder Bridge  Solder Bridge Shape Parameters  Mathematical Model  Risk Assessment
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