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Mechanical stress effect on the crystallization behavior of Ge2Sb2Te5 films studied by electrical resistance measurement
Authors:Yingchao Du  Yi Kan  Xiaomei Lu  Yunfei Liu  Huifeng Bo  Wei Cai  Dazhi Hu  Fengzhen Huang  Jinsong Zhu
Institution:1. National Laboratory of Solid State Microstructures and Physics School, Nanjing University, 210093 Nanjing, P.R. China;2. College of Science, Hebei United University, 063009 Tangshan, P.R. China;3. School of Physics and Electronic Engineering, Guangzhou University, 510006 Guangzhou, P.R. China;4. Department of Applied Physics, Nanjing University of Aeronautics and Astronautics, 210016 Nanjing, P.R. China;5. National Laboratory of Solid State Microstructures and Physics School, Nanjing University, 210093 Nanjing, P.R. ChinaPhone: 86‐25‐83593202, Fax: +86‐25‐83595535
Abstract:The mechanical stress effect on the crystallization behaviour of Ge2Sb2Te5(GST) thin films is carefully investigated by electrical resistance measurements. It is found that the crystallization temperature of GST films increases as external compressive stress is applied, while the crystallization temperature decreases under tensile stress. We also find that the uneven distribution of extrinsic stress can widen the span of transition temperature. These results clearly demonstrate that mechanical stress plays an important role during the crystallization process of GST films and may further influence the reliability and storage speed of relevant devices. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
Keywords:phase‐change materials  extrinsic stress  transition temperature  resistance
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